Teraoka

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6544 Polyimide film adhesive tape

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This tape has excellent heat resistance and plasma resistance and leaves little adhesive after removing after the plasma process.
Ideal for insulation of electronic components and use in manufacturing processes.

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Features

  • Strong peel adhesion, excellent heat resistance (260°C x 2 hours) and removability after plasma process (little adhesive remains when removed).

Structure

Purpose

  • Fixing and carrier during plasma irradiation treatment process.
  • Applications for stripping after high temperature heating processes such as reflow soldering.
  • Insulation and fixing of parts exposed to heat.

Characteristics

#50
Total thickness (mm) 0.09
Standard colors
Standard width (mm)
Standard length (m) 40
Peel adhesion (N/25mm)
The first adhesive side (the inner side) / The second side (the outer side)
3.75
Tensile strength(N/25㎜)
Elongation(%)
Breakdown voltage (kV)
Shear adhesive strength (N/400㎟)
Measurement conditions and other measurement items
Standards and Certification
Remarks This product does not intentionally use any of the 10 Rohs2 directive substances.

Notes

The above data are reference values measured by JIS or our test method and are not guaranteed values. Customers are advised to conduct tests in advance and use the product only after thoroughly confirming that it conforms to the intended use. Do not apply to the human body. Wipe off dust, oil, and moisture from the surface to be applied, and press firmly to apply. When storing, avoid direct sunlight, high temperature and high humidity. Products and product specifications are subject to discontinuation or change without notice.

For more information about our products, please contact the nearest branch or sales office.