This adhesive tape has excellent heat resistance, chemical resistance, and moisture sealing properties and leaves little adhesive residue.
Ideal for sealing and masking during resin molding.
Features
- Excellent heat resistance, chemical resistance, solvent resistance, and removability (little adhesive remains when removed).
- Suitable for resin encapsulation.
Structure
Purpose
- Resin molding masking (for chemical resistance).
- Heat-resistant masking.
- LED resin molding and encapsulation.
- Fixing of silicone components.
Characteristics
| #50 | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total thickness (mm) | 0.12 | ||||||||||
| Standard colors | Transparent | ||||||||||
| Standard width (mm) | － | ||||||||||
| Standard length (m) | 30 | ||||||||||
| Peel adhesion (N/25mm) The first adhesive side (the inner side) / The second side (the outer side) |
14.71 | ||||||||||
| Tensile strength(N/25㎜) | 208.4 | ||||||||||
| Elongation(%) | 80 | ||||||||||
| Breakdown voltage (kV) | － | ||||||||||
| Shear adhesive strength (N/400㎟) | － | ||||||||||
| Measurement conditions and other measurement items | － | ||||||||||
| Standards and Certification | － | ||||||||||
| Remarks | This product does not intentionally use any of the 10 Rohs2 directive substances. | ||||||||||
Notes
The above data are reference values measured by JIS or our test method and are not guaranteed values. Customers are advised to conduct tests in advance and use the product only after thoroughly confirming that it conforms to the intended use. Do not apply to the human body. Wipe off dust, oil, and moisture from the surface to be applied, and press firmly to apply. When storing, avoid direct sunlight, high temperature and high humidity. Products and product specifications are subject to discontinuation or change without notice.
For more information about our products, please contact the nearest branch or sales office.
