This tape leaves little adhesive remains after the heating process, suitable for the manufacturing process of electronic components.
Features
- Excellent removability (little adhesive remains when removed) even after heating process.
- The tape has little dimensional change by heating.
Structure
Purpose
- For heat resistant manufacturing process of electronic components.
- The thick base material allows it to be used as a carrier.
Characteristics
| #50 | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total thickness (mm) | 0.065 | ||||||||||
| Standard colors | － | ||||||||||
| Standard width (mm) | － | ||||||||||
| Standard length (m) | 30 | ||||||||||
| Peel adhesion (N/25mm) The first adhesive side (the inner side) / The second side (the outer side) |
7.00 | ||||||||||
| Tensile strength(N/25㎜) | － | ||||||||||
| Elongation(%) | － | ||||||||||
| Breakdown voltage (kV) | － | ||||||||||
| Shear adhesive strength (N/400㎟) | － | ||||||||||
| Measurement conditions and other measurement items | After 150°C x 2 hours Peel adhesion: 8.8 N/25mm - in-house test | ||||||||||
| Standards and Certification | － | ||||||||||
| Remarks | This product does not intentionally use any of the 10 Rohs2 directive substances. | ||||||||||
Notes
The above data are reference values measured by JIS or our test method and are not guaranteed values. Customers are advised to conduct tests in advance and use the product only after thoroughly confirming that it conforms to the intended use. Do not apply to the human body. Wipe off dust, oil, and moisture from the surface to be applied, and press firmly to apply. When storing, avoid direct sunlight, high temperature and high humidity. Products and product specifications are subject to discontinuation or change without notice.
For more information about our products, please contact the nearest branch or sales office.
